Title:
CIRCUIT MODULE AND INTERPOSER
Document Type and Number:
WIPO Patent Application WO/2018/139045
Kind Code:
A1
Abstract:
A purpose of the present invention is to provide a circuit module and an interposer that can reduce the area of a region that is needed in order to connect a circuit board and an external element. A circuit module according to the present invention comprises an interposer. The interposer includes: an element body; a first interposer terminal that is connected to a first external element; a second interposer terminal that is provided to the element body and is connected to a second external element; a first wire that is provided on the interior of the element body and electrically connects the first interposer terminal and a circuit board; a second wire that is provided on the interior of the element body and electrically connects the second interposer terminal and the circuit board; and a bypass wire that is provided on the interior and/or the surface of the element body and electrically connects the first interposer terminal and the second interposer terminal.
Inventors:
YONEMORI KEITO (JP)
YAZAKI HIROKAZU (JP)
TSUCHIYA TAKANORI (JP)
YAZAKI HIROKAZU (JP)
TSUCHIYA TAKANORI (JP)
Application Number:
PCT/JP2017/042931
Publication Date:
August 02, 2018
Filing Date:
November 30, 2017
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K1/14; H01L25/065; H01L25/07; H01L25/18; H01R12/62
Foreign References:
| US20140048928A1 | 2014-02-20 | |||
| JPH0548001A | 1993-02-26 | |||
| JPH08255976A | 1996-10-01 | |||
| JP2011258607A | 2011-12-22 | |||
| JP2006245193A | 2006-09-14 | |||
| JP2001077290A | 2001-03-23 | |||
| JP2009206230A | 2009-09-10 |
Attorney, Agent or Firm:
ASCEND IP LAW FIRM (JP)
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