Title:
INTERPOSER SUBSTRATE, CIRCUIT MODULE, AND METHOD FOR MANUFACTURING INTERPOSER SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2018/139046
Kind Code:
A1
Abstract:
An interposer substrate (10) includes a dielectric material section (20) and a magnetic material section (30), and has a first main surface, and a second main surface on the reverse side of the first main surface. A plurality of connection terminal electrodes (111, 112) are formed on the first main surface (201, 301) side of the dielectric material section (20) and the magnetic material section (30), and are connected to cables. A plurality of circuit board terminal electrodes (121, 122) are formed on a second main surface (202) of the dielectric material section (20), and are connected to a circuit board. A plurality of wiring electrodes are formed inside of an element body, and connect, in a predetermined connection pattern, the connection terminal electrodes (111, 112) and the circuit board terminal electrodes (121, 122) to each other. The wiring electrodes are provided with: first wiring electrodes (CH1) that pass through merely the dielectric material section (20); and second wiring electrodes (CH2) that pass through the magnetic material section (30).
Inventors:
YONEMORI KEITO (JP)
YAZAKI HIROKAZU (JP)
TSUCHIYA TAKANORI (JP)
KAMADA KOJI (JP)
YAZAKI HIROKAZU (JP)
TSUCHIYA TAKANORI (JP)
KAMADA KOJI (JP)
Application Number:
PCT/JP2017/042935
Publication Date:
August 02, 2018
Filing Date:
November 30, 2017
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K1/14; H01F17/00; H01F27/00; H05K1/18; H05K3/46
Foreign References:
| JP2003282785A | 2003-10-03 | |||
| JP2009218258A | 2009-09-24 | |||
| JP2015144165A | 2015-08-06 | |||
| JP2008140941A | 2008-06-19 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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