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Title:
CIRCUIT STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2017/154954
Kind Code:
A1
Abstract:
A circuit structure 10 comprises a coil device 12 including a ferrite core 14, and a heat sink 11 to which the coil device 12 is secured, wherein: the circuit structure includes a bottom wall 29 attached to the ferrite core 14, the bottom wall 29 being made of a first material having a thermal expansion coefficient greater than the thermal expansion coefficient of the ferrite core 14, and the bottom wall 29 being made of a second material having a thermal expansion coefficient greater than that of the ferrite core 14 and less than that of the heat sink 11; and the circuit structure includes an adhesive layer 35 disposed between the bottom wall 29 and the heat sink 11 and adhering the bottom wall 29 and the heat sink 11 together.

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Inventors:
TSUCHIDA TOSHIYUKI (JP)
YAMANE SHIGEKI (JP)
MAEDA HIROTOSHI (JP)
OTA TAKUYA (JP)
AICHI JUNYA (JP)
Application Number:
PCT/JP2017/009159
Publication Date:
September 14, 2017
Filing Date:
March 08, 2017
Export Citation:
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Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H01F27/06; H01F27/02
Domestic Patent References:
WO2016002326A12016-01-07
Foreign References:
JP2014067787A2014-04-17
JP2015201582A2015-11-12
Attorney, Agent or Firm:
AKATSUKI UNION PATENT FIRM (JP)
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