CIRCUIT STRUCTURE - AUTONETWORKS TECHNOLOGIES LTD

Title:

CIRCUIT STRUCTURE

Document Type and Number:

WIPO Patent Application WO/2024/004728

Kind Code:

A1

Abstract:

Disclosed is a circuit structure that makes it possible to directly draw heat without requiring a busbar to be routed from a terminal section of a heat-generating component, and to build a heat dissipation route for a heat-generating component in a space-efficient manner.　The circuit structure 10 includes: a heat pipe 14 configured so as to include a heat-generating component 12, a sealed container 34 with a hollow cylinder shape, a working fluid 36 sealed within the depressurized sealed container 34, and a capillary structure 38 provided to the inner wall of the sealed container 34; a first connection section 18 for energization provided so as to be continuous with one end section of the heat pipe 14 and connected to a terminal section 16 of the heat-generating component 12; and a second connection section 20 for energization provided so as to be continuous with the other end section of the heat pipe 14.

Inventors:

SUGIURA JO (JP)
KUBOKI HIDEYUKI (JP)
ISAJI YUSUKE (JP)

Application Number:

PCT/JP2023/022538

Publication Date:

January 04, 2024

Filing Date:

June 19, 2023

Export Citation:

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Assignee:

AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)

International Classes:

H05K7/20; F28D15/02; H01L23/427; H02G3/16

Foreign References:

JPS61138303U	1986-08-27
JPH04134119U	1992-12-14
JPH0334619U	1991-04-04
JP2016208674A	2016-12-08
JP2016081988A	2016-05-16
US20150047372A1	2015-02-19