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Title:
CIRCUIT SUBSTRATE, ELECTRONIC DEVICE AND MOUNTING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2016/017024
Kind Code:
A1
Abstract:
A technique is provided that can reduce noise while cutting costs. This circuit substrate is provided with a substrate, a circuit provided on the substrate, a connector mounted on the substrate, and a shield. The shield is provided between the circuit and the connector so as to surround at least the connector, and electrically is directly connected to a conductive housing unit.

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Inventors:
KOMIYA YASUMARO (JP)
Application Number:
PCT/JP2014/070312
Publication Date:
February 04, 2016
Filing Date:
August 01, 2014
Export Citation:
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Assignee:
HITACHI LTD (JP)
International Classes:
H05K1/02; H05K9/00
Foreign References:
JPH0927692A1997-01-28
JP2013254759A2013-12-19
JPS5741699U1982-03-06
Attorney, Agent or Firm:
Shoyo Intellectual Property Firm (JP)
Patent business corporation SHOYO Intellectual Property Firm (JP)
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