Title:
CIRCUIT SUBSTRATE, MANUFACTURING METHOD THEREFOR, AND MICRO LIGHT-EMITTING DIODE DISPLAY SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2020/187093
Kind Code:
A1
Abstract:
Provided are a circuit substrate, a manufacturing method therefor, and a micro light-emitting diode display substrate. The circuit substrate comprises: a substrate, wherein the substrate comprises a plurality of transfer printing areas: a plurality of collimation structures located in the plurality of transfer printing areas, wherein the collimation structure is used for supporting micro light-emitting diodes on the transfer printing areas, so that the micro light-emitting diodes are in a collimated state during transfer printing; and a plurality of fixing structures located in the plurality of transfer printing areas, wherein each fixing structure is used for fixing the corresponding micro light-emitting diode in the transfer printing area corresponding to the fixing structure.
Inventors:
ZHAO CHENGTAN (CN)
Application Number:
PCT/CN2020/078623
Publication Date:
September 24, 2020
Filing Date:
March 10, 2020
Export Citation:
Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
International Classes:
H01L27/15
Foreign References:
| CN109920815A | 2019-06-21 | |||
| CN108615741A | 2018-10-02 | |||
| CN106847796A | 2017-06-13 | |||
| CN107819003A | 2018-03-20 | |||
| CN109461752A | 2019-03-12 | |||
| US20190013297A1 | 2019-01-10 |
Attorney, Agent or Firm:
DRAGON INTELLECTUAL PROPERTY LAW FIRM (CN)
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