Title:
CIRCUIT SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2014/141492
Kind Code:
A1
Abstract:
A ceramic substrate in which a surface layer conductor having sufficient thickness to channel a large electric current is embedded on the surface, wherein cracking generated due to a change in temperature of the substrate is effectively suppressed. A ceramic substrate in which a surface layer conductor having sufficient thickness to channel a large electric current is embedded on the surface, wherein the cross-sectional shape of the portion of the surface layer conductor embedded in the base material on a plane perpendicular to the surface is configured so that the surface-side end part is larger than the end part on the opposite side of the surface.
Inventors:
AISAKA YUKIO (JP)
YAMAGUCHI HIROFUMI (JP)
YANO SHINSUKE (JP)
YAMAGUCHI HIROFUMI (JP)
YANO SHINSUKE (JP)
Application Number:
PCT/JP2013/066037
Publication Date:
September 18, 2014
Filing Date:
June 11, 2013
Export Citation:
Assignee:
NGK INSULATORS LTD (JP)
International Classes:
H05K1/02; H05K3/20
Foreign References:
| JP2001015895A | 2001-01-19 | |||
| JP2008300507A | 2008-12-11 | |||
| JP2000164996A | 2000-06-16 | |||
| JP2003258425A | 2003-09-12 | |||
| JPH05218019A | 1993-08-27 | |||
| JP2012190858A | 2012-10-04 | |||
| JPH0923044A | 1997-01-21 | |||
| JPH0563373A | 1993-03-12 | |||
| JPS6235693A | 1987-02-16 | |||
| JP2001015895A | 2001-01-19 |
Attorney, Agent or Firm:
PROSPEC PATENT FIRM (JP)
Patent business corporation Pros Peck patent firm (JP)
Patent business corporation Pros Peck patent firm (JP)
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