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Title:
CLEANING AGENT COMPOSITION AND METHOD FOR PRODUCING PROCESSED SEMICONDUCTOR SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2021/201047
Kind Code:
A1
Abstract:
A cleaning agent composition which is used for the purpose of removing an adhesive residue. This cleaning agent composition is characterized by containing a quaternary ammonium salt, a metal corrosion inhibitor and an organic solvent, and is also characterized in that the metal corrosion inhibitor is composed of an aliphatic saturated hydrocarbon compound monocarboxylic acid having from 7 to 40 carbon atoms, an aliphatic saturated hydrocarbon compound dicarboxylic acid having from 7 to 40 carbon atoms or an acid anhydride thereof, an aliphatic unsaturated hydrocarbon compound monocarboxylic acid having from 7 to 40 carbon atoms, or an aliphatic unsaturated hydrocarbon compound dicarboxylic acid having from 7 to 40 carbon atoms or an acid anhydride thereof.

Inventors:
OGINO HIROSHI (JP)
OKUNO TAKAHISA (JP)
YANAI MASAKI (JP)
MORIYA SHUNSUKE (JP)
OGATA HIROTO (JP)
FUKUDA TAKUYA (JP)
SHINJO TETSUYA (JP)
Application Number:
PCT/JP2021/013710
Publication Date:
October 07, 2021
Filing Date:
March 30, 2021
Export Citation:
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Assignee:
NISSAN CHEMICAL CORP (JP)
International Classes:
C11D1/62; C11D3/20; C11D3/43; H01L21/304
Domestic Patent References:
WO2020179819A12020-09-10
WO2020184618A12020-09-17
WO2014092022A12014-06-19
Foreign References:
JP2001316691A2001-11-16
JP2019516130A2019-06-13
JP2007254555A2007-10-04
JP2009197175A2009-09-03
JP2004501765A2004-01-22
JP2017199754A2017-11-02
JP2019532489A2019-11-07
US6818608B22004-11-16
KR20180066550A2018-06-19
Other References:
See also references of EP 4130217A4
Attorney, Agent or Firm:
KURIHARA, Hiroyuki et al. (JP)
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