Title:
CLEANING LIQUID COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2020/059782
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a cleaning liquid which can, in a short time, effectively remove abrasive grains and organic residues, derived from a slurry, from a semiconductor substrate in which a Co contact plug or a Co wire is present. The present invention relates to a cleaning liquid composition, which is used for cleaning a substrate having a Co contact plug and/or a Co wire, and which contains one or more types of reducing agent and water. The present invention also relates to a cleaning liquid composition, which is used for cleaning a substrate that contains Co but contains no Cu and which contains one or more types of reducing agent and water and has a pH of not less than 3 but less than 12.
Inventors:
TAKANAKA AREJI (JP)
Application Number:
PCT/JP2019/036709
Publication Date:
March 26, 2020
Filing Date:
September 19, 2019
Export Citation:
Assignee:
KANTO KAGAKU (JP)
International Classes:
C11D7/26; C11D7/22; H01L21/304
Domestic Patent References:
| WO2018043440A1 | 2018-03-08 |
Foreign References:
| JP2018026461A | 2018-02-15 | |||
| JP2008543060A | 2008-11-27 | |||
| JP2017005050A | 2017-01-05 | |||
| JP2008528762A | 2008-07-31 | |||
| JP2008543060A | 2008-11-27 | |||
| JP2015519723A | 2015-07-09 | |||
| JP2015524165A | 2015-08-20 |
Other References:
See also references of EP 3854865A4
Attorney, Agent or Firm:
KUZUWA, Kiyoshi (JP)
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