Title:
CLEANING METHOD AND CLEANING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/248995
Kind Code:
A1
Abstract:
The present disclosure provides a cleaning method and a cleaning device that enable cleaning of soiling particles adhered to a humidity adjusting member. The present disclosure is a cleaning method for cleaning soiling particles adhered to a humidity adjusting member, the method being characterized by including a cleaning step for cleaning using a second humidity adjusting liquid that has a lower equilibrium humidity than a first humidity adjusting liquid contained in the humidity adjusting member.
Inventors:
IDE TETSUYA
KAMADA TSUYOSHI
OCHI SHO
MATSUURA KYOKO
HAMADA HIROKA
SHIMIZU YUUSUKE
KAMADA TSUYOSHI
OCHI SHO
MATSUURA KYOKO
HAMADA HIROKA
SHIMIZU YUUSUKE
Application Number:
PCT/JP2023/022674
Publication Date:
December 28, 2023
Filing Date:
June 20, 2023
Export Citation:
Assignee:
SHARP KK (JP)
International Classes:
F28G9/00; B01D53/26; B01J20/34; F28D20/02
Foreign References:
| JP2005270958A | 2005-10-06 | |||
| JP2003117389A | 2003-04-22 | |||
| JP2014214479A | 2014-11-17 | |||
| JP2010196042A | 2010-09-09 |
Attorney, Agent or Firm:
INOUE Tomoya (JP)
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