Title:
CLEANING SOLUTION USED IN CLEANING PROCESS FOR SEMICONDUCTOR WAFER
Document Type and Number:
WIPO Patent Application WO/2022/262018
Kind Code:
A1
Abstract:
The present invention relates to a cleaning solution used in a cleaning process for a semiconductor wafer, the cleaning solution being made of the following raw materials in mass percentage: the mass percentage of guanidine or a guanidine derivative is 1-20%, the mass percentage of alkanolamine is 1-20%, the mass percentage of an antioxidant is 0.1-10%, and the mass percentage of an optional nitrogen-containing heterocyclic metal corrosion inhibitor is 0.01-5%. The cleaning solution in the present invention does not contain a quaternary ammonium base. The described cleaning solution can effectively remove abrasive particles, metal ions, and other residue remaining on the surface of a copper wafer after polishing, and does not significantly corrode a copper surface. In addition, the described cleaning solution can have protective properties for a barrier layer of cobalt used in semiconductor advanced nodes.
Inventors:
SUN XIUYAN (CN)
WANG QIAN (CN)
GUO LEI (CN)
SU JUN (CN)
JIN HUI (CN)
WANG QIAN (CN)
GUO LEI (CN)
SU JUN (CN)
JIN HUI (CN)
Application Number:
PCT/CN2021/104697
Publication Date:
December 22, 2022
Filing Date:
July 06, 2021
Export Citation:
Assignee:
ZHANGJIAGANG ANCHU TECH CO LTD (CN)
International Classes:
C11D7/34
Foreign References:
| CN109988675A | 2019-07-09 | |||
| CN110093616A | 2019-08-06 | |||
| CN102477359A | 2012-05-30 | |||
| US20020106976A1 | 2002-08-08 |
Attorney, Agent or Firm:
HEFEI KERONG INTELLECTUAL PROPERTY AGENCY (GENERAL PARTNERSHIP) (CN)
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