CMP POLISHING PAD HAVING PORES FORMED THEREIN, AND METHOD FOR MANUFACTURING SAME

WIPO Patent Application WO/2011/013894

A1

The present invention relates to a CMP polishing pad and to a method for manufacturing same, characterized in that a light-absorbing material for forming pores is dispersed in the pad. Pores formed in the CMP polishing pad of the present invention are formed by means of the breakdown of the light-absorbing material which absorbs a laser beam irradiated on the polishing pad, enabling the pore size to be controlled by controlling the amount of the light-absorbing material, the intensity of the laser beam, etc., and enabling pore distribution to be freely controlled through the CNC (Computer Numerical Control) technique. Accordingly, a CMP polishing pad can be provided that exhibits the highest polishing effectiveness in accordance with the material to be polished or the type of slurry.

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KIM CHIL MIN (KR)

PCT/KR2010/002731

February 03, 2011

April 30, 2010

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UNIV SOGANG IND UNIV COOP FOUN (KR)
KIM CHIL MIN (KR)

H01L21/304

US20070235904A1	2007-10-11
KR100487455B1	2005-05-09
KR100191227B1	1999-06-15
KR20070021929A	2007-02-23
KR100497205B1	2005-06-23

J.C.HYUN PATENT & LAW FIRM (KR)
특허법인 충현 (KR)

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