CMP SLURRY COMPOSITION AND ORGANIC FILM POLISHING METHOD USING SAME

Title:

CMP SLURRY COMPOSITION AND ORGANIC FILM POLISHING METHOD USING SAME

Document Type and Number:

WIPO Patent Application WO/2017/090889

Kind Code:

A1

Abstract:

The present invention relates to a CMP slurry composition containing: an oxidant comprising an iron component; an organic acid having one carboxyl group; and water, and to an organic film polishing method using the same.

More Like This:

JP2018157164	POLISHING COMPOSITION, MANUFACTURING METHOD THEREOF, POLISHING METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE
WO/2009/031389	AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING AND METHOD FOR PREPARING THE SAME, KIT FOR PREPARING AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING, AND CHEMICAL MECHANICAL POLISHING METHOD FOR SEMICONDUCTOR DEVICE
WO/2015/047970	CHEMICAL-MECHANICAL PLANARIZATION OF POLYMER FILMS

Inventors:

KANG DONG HUN (KR)
KIM JEONG HEE (KR)
CHOI JUNG MIN (KR)
YOO YONG SIK (KR)

Application Number:

PCT/KR2016/011624

Publication Date:

June 01, 2017

Filing Date:

October 17, 2016

Export Citation:

Click for automatic bibliography generation Help

Assignee:

SAMSUNG SDI CO LTD (KR)

International Classes:

C09K3/14; H01L21/304; H01L21/306

Foreign References:

KR20150115824A	2015-10-14
KR20100028072A	2010-03-11
KR20060099313A	2006-09-19
KR20040055042A	2004-06-26
KR20140030792A	2014-03-12

Attorney, Agent or Firm:

AJU INT'L LAW & PATENT GROUP (KR)

Download PDF:

View/Download PDF PDF Help

Previous Patent: INTELLIGENT INTEGRATED SWITCH COMBINED WITH WIRELESS NETWORK FUNCTION FOR ESTABLISHING IOT ...

Next Patent: EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE SEALED US...