EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE SEALED USING SAME

Title:

EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE SEALED USING SAME

Document Type and Number:

WIPO Patent Application WO/2017/090890

Kind Code:

A1

Abstract:

The present invention relates to an epoxy resin composition for sealing a semiconductor device, the composition containing an epoxy resin, a curing agent, an inorganic filler, and a flame retardant represented by chemical formula 1, and to a semiconductor device sealed by the same. In chemical formula 1, R is hydrogen or a C1-C20 hydrocarbon group.

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Inventors:

HAN SEUNG (KR)
CHUNG JOO YOUNG (KR)
KIM MIN GYUM (KR)

Application Number:

PCT/KR2016/011745

Publication Date:

June 01, 2017

Filing Date:

October 19, 2016

Export Citation:

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Assignee:

SAMSUNG SDI CO LTD (KR)

International Classes:

C08K5/50; C08K3/00; C08L63/00; H01L23/28

Foreign References:

JP2002105171A	2002-04-10
KR20140082528A	2014-07-02
JP2004269586A	2004-09-30
KR20150011747A	2015-02-02
US20110201724A1	2011-08-18

Attorney, Agent or Firm:

AJU INT'L LAW & PATENT GROUP (KR)

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