Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
COA SUBSTRATE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2016/086434
Kind Code:
A1
Abstract:
A COA substrate and a manufacturing method therefor. The method comprises: sequentially forming a first metal layer (12), a gate insulating layer (13), an active layer (14), an ohmic contact layer (15), a second metal layer (16), a first passivation layer (17), a colour resistance layer (18), a second passivation layer (19), a via hole (21) and a transparent conductive layer (20) on an underlayer substrate (11); forming an isolator (22) and/or a black matrix (42) on a surface of the COA substrate; and filling the via hole (21) within an organic material, such as an isolator material or a black matrix material.

Inventors:
SONG LIWANG (CN)
Application Number:
PCT/CN2014/093418
Publication Date:
June 09, 2016
Filing Date:
December 10, 2014
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SHENZHEN CHINA STAR OPTOELECT (CN)
International Classes:
H01L27/32
Foreign References:
CN104049430A2014-09-17
CN103794633A2014-05-14
JP2006098756A2006-04-13
CN102012592A2011-04-13
Attorney, Agent or Firm:
ESSEN PATENT&TRADEMARK AGENCY (CN)
深圳翼盛智成知识产权事务所(普通合伙) (CN)
Download PDF: