Title:
COATING COMPOSITIONS FOR SOLDER SPHERES, POWDERS AND PREFORMS, METHODS OF PRODUCTION AND USES THEREOF
Document Type and Number:
WIPO Patent Application WO2004047507
Kind Code:
A3
Abstract:
A solder material has been produced and is described herein that comprises a conventional solder component, such as a solder sphere, solder ball, solder powder, solder preform, some other suitable material or form of solder or a combination thereof and a coating composition. Solder parts and/or solder materials described herein may be produced by a) providing a solder component, b) providing a coating precursor material, c) providing a solvent, d) blending the coating precursor material and the solvent, such that the coating precursor material is substantially solvated, to form a coating composition, and e) applying or coupling the coating composition to the solder component.
Inventors:
FLINT JAMES (US)
Application Number:
PCT/US2003/037663
Publication Date:
August 26, 2004
Filing Date:
November 13, 2003
Export Citation:
Assignee:
HONEYWELL INT INC (US)
FLINT JAMES (US)
FLINT JAMES (US)
International Classes:
C21D1/613; C21D9/34; C22C13/00; C21D1/667; H05K3/34; (IPC1-7): B23K31/02; B32B15/08; C08J7/04
Foreign References:
| US6490170B2 | 2002-12-03 | |||
| US6475328B2 | 2002-11-05 | |||
| US6261671B1 | 2001-07-17 | |||
| US6136506A | 2000-10-24 | |||
| US5972562A | 1999-10-26 |
Download PDF: