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Title:
COATING RESIN COMPOSITION FOR ELECTRIC WIRE, AND ELECTRIC WIRE
Document Type and Number:
WIPO Patent Application WO/2014/189016
Kind Code:
A1
Abstract:
Provided are: a coating resin composition for an electric wire, said coating resin composition comprising an ETFE-based copolymer and being capable of forming a coating layer that exhibits excellent resistance to thermal stress-cracking and good mechanical characteristics; and an electric wire which has a coating layer that exhibits excellent resistance to thermal stress-cracking and good mechanical characteristics. A coating resin material which is to be applied to an electric wire and which comprises a resin component (X) composed of one or more copolymers (A) that each have units derived from tetrafluoroethylene and units derived from ethylene, wherein: at least one of the copolymers (A) is a copolymer (A1) that further has units derived from a monomer having two or more polymerizable carbon-carbon double bonds or units derived from a monomer having a radical-generating group; the rate of strain hardening of the resin component (X) is 0.1 to 0.45, (the rate of strain hardening being a parameter which expresses the degree of a strain hardening property that extensional viscosity deviates from a linear region and sharply increases in a high-strain region); and the melt flow rate of the resin component (X) is 1 to 200g/10min.

Inventors:
YAMAMOTO TATSUYA (JP)
NISHI EIICHI (JP)
SATO TAKASHI (JP)
Application Number:
PCT/JP2014/063244
Publication Date:
November 27, 2014
Filing Date:
May 19, 2014
Export Citation:
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Assignee:
ASAHI GLASS CO LTD (JP)
International Classes:
H01B3/44; C08F214/26; C08L27/18; H01B7/02
Domestic Patent References:
WO2009096547A12009-08-06
WO2010123002A12010-10-28
WO2008069278A12008-06-12
WO2009096547A12009-08-06
WO2009096544A12009-08-06
Foreign References:
JP2012021054A2012-02-02
JPS6116932A1986-01-24
JPH0636618A1994-02-10
JPH0741522A1995-02-10
Other References:
See also references of EP 3001427A4
Attorney, Agent or Firm:
SENMYO, Kenji et al. (JP)
Spring name Kenji (JP)
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