Title:
COVERING MATERIAL FOR HEAT-RESISTANT ELECTRIC WIRES, METHOD FOR PRODUCING SAME, AND ELECTRIC WIRE
Document Type and Number:
WIPO Patent Application WO/2014/189017
Kind Code:
A1
Abstract:
Provided are: a covering material for heat-resistant electric wires, which is capable of covering a core wire without being torn at a weld line and has excellent stress cracking resistance at high temperatures; a method for producing this covering material for heat-resistant electric wires; and an electric wire.
A covering material for heat-resistant electric wires, which is formed of a fluorine-containing copolymer composition that contains a fluorine-containing copolymer (A) that is melt moldable and a non-fluorine thermoplastic resin (B1) at a volume ratio (A)/(B1) of from 99/1 to 60/40. The non-fluorine thermoplastic resin (B1) is contained in the fluorine-containing copolymer composition in the form of fine particles having an average dispersion particle diameter of 8 μm or less, and the storage modulus of the fluorine-containing copolymer composition at 200°C as determined by dynamic viscoelasticity measurement is 90 MPa or more. A non-fluorine resin (B2) that does not have a melting point at 450°C or less may be contained in place of the non-fluorine thermoplastic resin (B1) so as to serve as the fine particles having an average dispersion particle diameter of 8 μm or less.
Inventors:
HOSODA TOMOYA (JP)
ABE MASATOSHI (JP)
SATO TAKASHI (JP)
ABE MASATOSHI (JP)
SATO TAKASHI (JP)
Application Number:
PCT/JP2014/063245
Publication Date:
November 27, 2014
Filing Date:
May 19, 2014
Export Citation:
Assignee:
ASAHI GLASS CO LTD (JP)
International Classes:
H01B7/29; C08J3/20; C08L27/12; C08L79/08; H01B3/30; H01B3/44; H01B13/14
Domestic Patent References:
| WO2011024809A1 | 2011-03-03 | |||
| WO2010110129A1 | 2010-09-30 |
Foreign References:
| JPH11209548A | 1999-08-03 | |||
| JPH09118802A | 1997-05-06 | |||
| US6121353A | 2000-09-19 | |||
| JP2006066329A | 2006-03-09 | |||
| JP2012113119A | 2012-06-14 | |||
| JP2007314720A | 2007-12-06 | |||
| JPH11193312A | 1999-07-21 |
Other References:
See also references of EP 3001429A4
Attorney, Agent or Firm:
SENMYO, Kenji et al. (JP)
Spring name Kenji (JP)
Spring name Kenji (JP)
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