Title:
COIL SUBSTRATE, MANUFACTURING METHOD THEREFOR AND ELECTRONIC DEVICE COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2023/191568
Kind Code:
A1
Abstract:
Provided are a coil substrate, a manufacturing method therefor and an electronic device comprising same, the coil substrate having lead-in wiring controlled to be thinly formed rather than plated with the level of thickness of a coil conductor pattern, thereby resolving problems such as damage to the exterior of the coil substrate and electrical shorting defects. The coil substrate includes: a base substrate; a first seed pattern, which is formed on a first surface of the base substrate and includes a seed region and a lead-in wiring region; a first coil formed on the seed region of the first seed pattern; a first seed pattern protection layer formed on the lead-in wiring region of the first seed pattern; and a first insulation layer in contact with least one surface of the seed pattern protection layer.
Inventors:
KIM DONG GON (KR)
KIM YOUNG JUN (KR)
KIM HONG MAN (KR)
SHIN SU JEONG (KR)
KIM YOUNG JUN (KR)
KIM HONG MAN (KR)
SHIN SU JEONG (KR)
Application Number:
PCT/KR2023/004327
Publication Date:
October 05, 2023
Filing Date:
March 30, 2023
Export Citation:
Assignee:
STEMCO CO LTD (KR)
International Classes:
H01F17/00; H01F5/00; H01F27/28
Foreign References:
| KR20200004538A | 2020-01-14 | |||
| KR100544173B1 | 2006-01-23 | |||
| JP2010212468A | 2010-09-24 | |||
| KR20170112522A | 2017-10-12 | |||
| JP2020065007A | 2020-04-23 |
Attorney, Agent or Firm:
KASAN IP & LAW FIRM (KR)
Download PDF: