Title:
COIL SUBSTRATE, COIL SUBSTRATE FOR MOTOR, AND MOTOR
Document Type and Number:
WIPO Patent Application WO/2023/145751
Kind Code:
A1
Abstract:
The present invention provides technology that enables wiring on an inner peripheral layer and wiring on an outer peripheral layer to be positioned more accurately when a coil substrate is wound into a cylindrical shape. The coil substrate comprises: a flexible substrate having a first surface and a second surface on the reverse side from the first surface; and a coil formed from coil-shaped wiring provided on the first surface and coil-shaped wiring provided on the second surface. The coil substrate can be formed into a cylindrical shape by being circumferentially wound about an axis extending in the lateral direction orthogonal to the longitudinal direction, starting from a reference side at one end in the longitudinal direction of the flexible substrate. The flexible substrate has recesses formed on at least one of the two sides thereof in the width direction.
Inventors:
HIRASAWA TAKAHISA (JP)
FURUNO TAKAYUKI (JP)
FURUNO TAKAYUKI (JP)
Application Number:
PCT/JP2023/002174
Publication Date:
August 03, 2023
Filing Date:
January 25, 2023
Export Citation:
Assignee:
IBIDEN CO LTD (JP)
International Classes:
H02K3/26; H02K3/47
Domestic Patent References:
| WO2015111579A1 | 2015-07-30 |
Foreign References:
| JP2021190485A | 2021-12-13 | |||
| JPS5963941A | 1984-04-11 | |||
| JPS4914970A | 1974-02-08 |
Attorney, Agent or Firm:
MORI Norihisa (JP)
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