Title:
COIL SUBSTRATE, COIL SUBSTRATE FOR MOTOR, AND MOTOR
Document Type and Number:
WIPO Patent Application WO/2023/145752
Kind Code:
A1
Abstract:
Provided are a coil substrate with which a motor having stable performance can be obtained; a coil substrate for motors which is formed by using the coil substrate; and a motor formed by using the coil substrate for motors. The coil substrate comprises a flexible substrate having a first surface and a second surface opposite the first surface; and a plurality of coils formed by first wiring provided on the first surface and second wiring provided on the second surface. The coil substrate can be formed in a cylindrical shape in which the first surface is placed on the inner peripheral side and the second surface is placed on the outer peripheral side by being circumferentially wound about an axis extending, from a first end in the longitudinal direction of the flexible substrate as a start point, in a direction orthogonal to the longitudinal direction. The flexible substrate has a first region in the neighborhood of the first end, and a second region adjacent to the first region. The second wiring is formed in the first region, and the first wiring is not formed in the first region.
Inventors:
HIRASAWA TAKAHISA (JP)
FURUNO TAKAYUKI (JP)
FURUNO TAKAYUKI (JP)
Application Number:
PCT/JP2023/002175
Publication Date:
August 03, 2023
Filing Date:
January 25, 2023
Export Citation:
Assignee:
IBIDEN CO LTD (JP)
International Classes:
H02K3/26
Foreign References:
| JP2017070140A | 2017-04-06 | |||
| US20090072651A1 | 2009-03-19 | |||
| JP2013062999A | 2013-04-04 | |||
| JP2011087437A | 2011-04-28 |
Attorney, Agent or Firm:
MORI Norihisa (JP)
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