Title:
COMPLEX GRINDING MACHINE
Document Type and Number:
WIPO Patent Application WO/2023/032196
Kind Code:
A1
Abstract:
In a process in which grinding is performed after additive manufacturing, the present invention reduces the amount of a portion of a coating, formed during the additive manufacturing, that exceeds a thickness necessary for a product. This complex grinding machine comprises: a holding unit capable of holding and rotating a workpiece; an additive manufacturing unit that is movable with respect to the holding unit, melts a material while supplying the material to a surface of the workpiece held by the holding unit, and thereby adheres the material to the surface; a grinding unit that is movable with respect to the holding unit, has a grindstone, and rotates the grindstone; and a coolant supply unit that supplies a coolant to a location at which the workpiece held by the holding unit contacts the grindstone.
Inventors:
TANO MAKOTO (JP)
NAGAHAMA TAKAYA (JP)
USUDA KEISUKE (JP)
SHIIBA KOICHI (JP)
KATO KOHEI (JP)
ITO MASATO (JP)
NAGAHAMA TAKAYA (JP)
USUDA KEISUKE (JP)
SHIIBA KOICHI (JP)
KATO KOHEI (JP)
ITO MASATO (JP)
Application Number:
PCT/JP2021/032635
Publication Date:
March 09, 2023
Filing Date:
September 06, 2021
Export Citation:
Assignee:
JTEKT CORP (JP)
International Classes:
B24B5/04; B23K26/342; B23P23/04
Domestic Patent References:
| WO2015091837A1 | 2015-06-25 |
Foreign References:
| US4980534A | 1990-12-25 | |||
| JP2017018979A | 2017-01-26 | |||
| JP6810823B1 | 2021-01-06 |
Attorney, Agent or Firm:
BENRISHIHOJIN MEISEI INTERNATIONAL PATENT FIRM (JP)
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