Title:
COMPLEX GRINDING MACHINE
Document Type and Number:
WIPO Patent Application WO/2023/032197
Kind Code:
A1
Abstract:
This complex grinding machine comprises: a holding unit capable of holding and rotating a workpiece; an additive manufacturing unit that is movable with respect to the holding unit and melts a material while supplying the material to a surface of the workpiece held by the holding unit, to thereby cause the material to attach to the surface; a grinding unit that is movable with respect to the holding unit, has a grindstone, and rotates the grindstone; and a thermal strain reduction unit that allows the material attached to the surface to be ground by the grinding unit in a state in which the influence of heat generated due to the attachment of the material to the surface is reduced.
Inventors:
TANO MAKOTO (JP)
NAGAHAMA TAKAYA (JP)
USUDA KEISUKE (JP)
SHIIBA KOICHI (JP)
KATO KOHEI (JP)
ITO MASATO (JP)
NAGAHAMA TAKAYA (JP)
USUDA KEISUKE (JP)
SHIIBA KOICHI (JP)
KATO KOHEI (JP)
ITO MASATO (JP)
Application Number:
PCT/JP2021/032641
Publication Date:
March 09, 2023
Filing Date:
September 06, 2021
Export Citation:
Assignee:
JTEKT CORP (JP)
International Classes:
B24B5/04; B23K26/342; B23P23/04
Foreign References:
| JP6810823B1 | 2021-01-06 | |||
| JPH0270959U | 1990-05-30 |
Attorney, Agent or Firm:
BENRISHIHOJIN MEISEI INTERNATIONAL PATENT FIRM (JP)
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