Title:
COMPLIANT INTERCONNECT PILLARS WITH ORIENTATION OR GEOMETRY DEPENDENT ON THE POSITION ON A DIE OR FORMED WITH A PATTERNED STRUCTURE BETWEEN THE PILLAR AND A DIE PAD FOR REDUCTION OF THERMAL STRESS
Document Type and Number:
WIPO Patent Application WO/2013/013204
Kind Code:
A3
Abstract:
Pillars (300, 306, 502) having a directed compliance geometry are arranged to couple a semiconductor die (400, 500) to a substrate. The direction of maximum compliance of each pillar (300, 306, 502) may be aligned with the direction of maximum stress caused by unequal thermal expansion and contraction of the semiconductor die (400, 500) and the substrate. Pillars (300, 306, 502) may be designed and constructed with various shapes having particular compliance characteristics and particular directions (302, 304, 308, 310, 504) of maximum compliance. The shape and orientation of the pillars (300, 306, 502) may be selected as a function of their location on a die (400, 500) to accommodate the direction and magnitude of stress at their location. Pillars (610) may also be fabricated with particular shapes by patterning a material (604) such as a passivation material on a pad on a die (600) to increase the surface area upon which the pillar (610) is plated or deposited.
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Inventors:
BAO ZHONGPING (US)
BURRELL JAMES D (US)
GU SHIQUN (US)
BURRELL JAMES D (US)
GU SHIQUN (US)
Application Number:
PCT/US2012/047722
Publication Date:
March 14, 2013
Filing Date:
July 20, 2012
Export Citation:
Assignee:
QUALCOMM INC (US)
BAO ZHONGPING (US)
BURRELL JAMES D (US)
GU SHIQUN (US)
BAO ZHONGPING (US)
BURRELL JAMES D (US)
GU SHIQUN (US)
International Classes:
H01L21/60; H01L23/485
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Attorney, Agent or Firm:
GALLARDO, Michelle S. (San Diego, California, US)
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