Title:
COMPONENT-EMBEDDED SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2016/035631
Kind Code:
A1
Abstract:
In order to reduce transmission loss within the substrate of a component-embedded substrate, this component-embedded substrate (10) is equipped with: thermoplastic resin substrates (111-116); an electronic component (21) arranged on the thermoplastic resin substrate (112) and provided with a terminal (211); and an electronic component (22) arranged on the thermoplastic resin substrate (115) and provided with a terminal (221). For the electronic component (21) the terminal (211) is arranged facing toward the electronic component (22) in the lamination direction. For the electronic component (22) the terminal (221) is arranged facing toward the electronic component (21) in the lamination direction. On the thermoplastic resin substrate (113) there is formed a planar conductor (331) to which the terminal (221) is directly bonded by ultrasonic bonding. On the thermoplastic resin substrate (114) there is formed an interlayer connection conductor (441) to which the terminal (221) is directly bonded, and which is electrically connected to the planar conductor (331).
Inventors:
TAGO SHIGERU (JP)
TSURUGA DAISUKE (JP)
TSURUGA DAISUKE (JP)
Application Number:
PCT/JP2015/073953
Publication Date:
March 10, 2016
Filing Date:
August 26, 2015
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K3/46
Domestic Patent References:
| WO2014069107A1 | 2014-05-08 |
Foreign References:
| JP2002164461A | 2002-06-07 | |||
| JP2010010537A | 2010-01-14 | |||
| JP2006344631A | 2006-12-21 | |||
| JP2013207194A | 2013-10-07 |
Attorney, Agent or Firm:
Kaede Patent Attorneys' Office (JP)
Patent business corporation Kaede Patent Attorneys' Office (JP)
Patent business corporation Kaede Patent Attorneys' Office (JP)
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