COMPONENT INSTALLATION STRUCTURE FOR MOUNTING TO SUBSTRATE

WIPO Patent Application WO/2014/073434

A1

In this component installation structure for mounting to a substrate, a flow path that allows a fluid to flow therethrough and an installation hole that communicates with the flow path are provided to a cast metal substrate, and a flange section that is provided to a mounting component that is installed on the substrate is configured so as to be sandwiched in a fluid-tight manner between an annular stepped section that is formed on the inner peripheral-side wall of the installation hole and that faces outward and a plastic deformation section that is formed by causing plastic flow of the inner peripheral-side wall of the installation hole at a location that is more to the outside than the stepped section. A local surface pressure section (44A) is formed between the stepped section (46A) and the flange section (21A) and brings the stepped section (46A) and the flange section (21A) into linear contact in an annular manner along the peripheral direction of the installation hole (12A). As a result, it is possible to increase the contact surface pressure between the flange section of the mounting component and the stepped section of the substrate, and to maintain sufficient sealing properties even when a blowhole exists in the vicinity of the plastic deformation section of the substrate.

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IIJIMA JUN (JP)
OTA KAZUHIRO (JP)
YAMADA NAOKI (JP)

PCT/JP2013/079418

May 15, 2014

October 30, 2013

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NISSIN KOGYO KK (JP)

B60T8/34; F04B53/00; F04B53/10; F16K27/00; F16K31/06

JPH11218074A	1999-08-10
JP2000120528A	2000-04-25
JPH11257245A	1999-09-21
JPH10507812A	1998-07-28
JPH10507982A	1998-08-04

OCHIAI Takeshi et al. (JP)
Ochiai 健 (JP)

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