Title:
COMPONENT MOUNTER
Document Type and Number:
WIPO Patent Application WO/2019/171602
Kind Code:
A1
Abstract:
A component mounter mounts electronic components on a substrate. This component mounter comprises: an attachment tool that receives an electronic component in a component supply position and releases the received electronic component in a prescribed position over the substrate; an accommodation unit that accommodates multiple types of attachment tools; a head that removably attaches one attachment tool selected from among the multiple types of attachment tools accommodated in the accommodation unit; a movement mechanism that moves the head between the component supply position and the prescribed position over the substrate; an abnormality detector that detects abnormalities related to the attachment tools; and a selector that selects an attachment tool to attach to the head, the selector making it possible to select a second type of attachment tool that differs from a first type of attachment tool that is attached to the head when an abnormality is detected by the abnormality detector.
Inventors:
AOU HIROYUKI (JP)
Application Number:
PCT/JP2018/009345
Publication Date:
September 12, 2019
Filing Date:
March 09, 2018
Export Citation:
Assignee:
FUJI CORP (JP)
International Classes:
H05K13/04
Foreign References:
| JP2003060394A | 2003-02-28 | |||
| JP2010118561A | 2010-05-27 | |||
| JP2002111286A | 2002-04-12 | |||
| JP2012248815A | 2012-12-13 |
Other References:
See also references of EP 3764762A4
Attorney, Agent or Firm:
KAI-U PATENT LAW FIRM (JP)
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