Title:
COMPONENT MOUNTING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2020/105134
Kind Code:
A1
Abstract:
This component mounting apparatus is provided with: a suction nozzle; a movement device which relatively moves the suction nozzle with respect to a component supply device; an imaging device which captures an image of a component suctioned by the suction nozzle; and a control device that executes suction control for controlling the movement device so that the component supplied by the component supply device is suctioned by the suction nozzle at a target suction position, and that executes a target suction position update process for controlling the movement device and the imaging device so that the image of the component suctioned by the suction nozzle is captured at a predetermined imaging position, updating the target suction position according to a compensation amount corresponding to an amount of positional displacement of the component recognized on the basis of the captured image of the component when the compensation amount has not reached a limit, and updating the target suction position according to a compensation amount which is less than the limit when the compensation amount corresponding to the amount of positional displacement has reached the limit.
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Inventors:
SAKURAYAMA TAKESHI (JP)
Application Number:
PCT/JP2018/042962
Publication Date:
May 28, 2020
Filing Date:
November 21, 2018
Export Citation:
Assignee:
FUJI CORP (JP)
International Classes:
H05K13/08; H05K13/04
Domestic Patent References:
| WO2013046987A1 | 2013-04-04 |
Foreign References:
| JP2012502321A | 2012-01-26 | |||
| JP2012190297A | 2012-10-04 | |||
| JP2014107714A | 2014-06-09 |
Attorney, Agent or Firm:
ITEC INTERNATIONAL PATENT FIRM (JP)
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