Title:
COMPONENT MOUNTING DEVICE AND EVALUATION METHOD
Document Type and Number:
WIPO Patent Application WO/2023/026564
Kind Code:
A1
Abstract:
A component mounting device (10) mounts a component to a substrate (1), and comprises: a suction nozzle (24) that has a suction surface (26) for suctioning the component; an imaging unit (32) that images the suction surface (26); and an evaluation unit (42) that evaluates a wear condition of the suction surface (26) on the basis of an image imaged by the imaging unit (32).
More Like This:
Inventors:
MAWATARI MICHIAKI
Application Number:
PCT/JP2022/014866
Publication Date:
March 02, 2023
Filing Date:
March 28, 2022
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
H05K13/08
Foreign References:
JP2004071975A | 2004-03-04 | |||
JPH0722783A | 1995-01-24 | |||
JPH1013093A | 1998-01-16 |
Attorney, Agent or Firm:
NII, Hiromori et al. (JP)
Download PDF:
Previous Patent: ROTARY ELECTRICAL MACHINE AND WASHING MACHINE EQUIPPED WITH SAME
Next Patent: IMAGING DEVICE, AND ELECTRONIC APPARATUS
Next Patent: IMAGING DEVICE, AND ELECTRONIC APPARATUS