Title:
COMPONENT MOUNTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/029750
Kind Code:
A1
Abstract:
A component mounting device 10 is provided with a controller for controlling a mounting head. The mounting head is provided with: a nozzle holder 30; a nozzle 42 resiliently supported so as to be vertically movable with respect to the nozzle holder 30; a flange 42c disposed in a position offset from a central axis of the nozzle 42; and a second engaging portion 52 capable of moving the nozzle 42 downward by engaging and pressing the flange 42c down against the resilience of a nozzle spring 46. The controller previously measures an error amount of the tip position of the nozzle 42 before and after the downward movement of the nozzle 42 by the second engaging portion 52, and, by taking the error amount into consideration, controls the mounting head to suction and mount a component on a substrate.
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Inventors:
FUJISHIRO TAKESHI (JP)
KAWAGUCHI KOJI (JP)
SANJI MITSURU (JP)
SUGIHARA KOHEI (JP)
KAWAGUCHI KOJI (JP)
SANJI MITSURU (JP)
SUGIHARA KOHEI (JP)
Application Number:
PCT/JP2015/073338
Publication Date:
February 23, 2017
Filing Date:
August 20, 2015
Export Citation:
Assignee:
FUJI MACHINE MFG (JP)
International Classes:
H05K13/04
Domestic Patent References:
| WO2014080472A1 | 2014-05-30 |
Foreign References:
| JP2008041712A | 2008-02-21 | |||
| JPH11204992A | 1999-07-30 | |||
| JP2013251398A | 2013-12-12 | |||
| JPH0637485A | 1994-02-10 | |||
| JP2015192029A | 2015-11-02 |
Other References:
See also references of EP 3340760A4
Attorney, Agent or Firm:
ITEC INTERNATIONAL PATENT FIRM (JP)
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