Title:
COMPONENT MOUNTING METHOD AND COMPONENT MOUNTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2011/089681
Kind Code:
A1
Abstract:
Disclosed is a component mounting method wherein a component mounting device (200) mounts a component onto a substrate, the component mounting device (200) comprising a conveying device (220) having a plurality of rails which can convey a plurality of substrates in parallel to one another. In order to ensure that the centre in the forward-backward direction of a mounting region, which is the region wherein two mounting heads (213a, 213b) mount a component onto at least one substrate which is conveyed on the conveying device (220), is positioned in a central position between two the mounting heads (213a, 213b), which is the position that is equidistant in the forward-backward direction from the two mounting heads (213a, 213b), the disclosed method includes arrangement steps (S108-S122) for arranging the rails, and a mounting step (S114) wherein two mounting heads (213a, 213b) alternately mount components in the mounting region.
Inventors:
KIDO KAZUO
KAIDA KENICHI
KAIDA KENICHI
Application Number:
PCT/JP2010/007585
Publication Date:
July 28, 2011
Filing Date:
December 28, 2010
Export Citation:
Assignee:
PANASONIC CORP (JP)
KIDO KAZUO
KAIDA KENICHI
KIDO KAZUO
KAIDA KENICHI
International Classes:
H05K13/04
Foreign References:
JP2006080158A | 2006-03-23 | |||
JP2009224764A | 2009-10-01 | |||
JP2003204192A | 2003-07-18 | |||
JP2009253070A | 2009-10-29 | |||
JPH0837398A | 1996-02-06 | |||
JP2008060543A | 2008-03-13 |
Attorney, Agent or Firm:
NII, Hiromori (JP)
New house Extensive 守 (JP)
New house Extensive 守 (JP)
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Claims: