Title:
COMPOSITE BODY COMPRISING SILICON CARBIDE AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2022/196241
Kind Code:
A1
Abstract:
Provided is a silicon carbide composite body that can be expected to demonstrate efficient heat conduction and electrical conduction between base materials that are joined together. This silicon carbide composite body comprises: a first base material that includes silicon carbide with a silicon oxide layer SiOx formed on the surface thereof; and a second base material that has, on the surface thereof, an oxide layer MOy of an element M which is at least one of a metal that forms an oxide in the atmosphere (excluding alkali metals and alkali earth metals), Si, Ge, As, Se, Sb, and C in diamond, and that bonds with the first base material such that the MOy side faces the SiOx side. At least a portion of carbons in the silicon carbide forms a C-O-M bond, and/or at least a portion of silicon in the silicon carbide forms a Si-O-M bond, allowing the bonding of the second base material to the first base material.
Inventors:
MATSUMAE TAKASHI (JP)
TAKAGI HIDEKI (JP)
UMEZAWA HITOSHI (JP)
KURASHIMA YUUICHI (JP)
HIGURASHI EIJI (JP)
TAKAGI HIDEKI (JP)
UMEZAWA HITOSHI (JP)
KURASHIMA YUUICHI (JP)
HIGURASHI EIJI (JP)
Application Number:
PCT/JP2022/006549
Publication Date:
September 22, 2022
Filing Date:
February 18, 2022
Export Citation:
Assignee:
AIST (JP)
International Classes:
H01L21/02
Domestic Patent References:
| WO2020230520A1 | 2020-11-19 |
Foreign References:
| JP2006206377A | 2006-08-10 | |||
| JP2009117533A | 2009-05-28 | |||
| JP2014003105A | 2014-01-09 | |||
| JP2014209527A | 2014-11-06 |
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