Title:
COMPOSITE COPPER NANOPARTICLES, AND METHOD FOR MANUFACTURING COMPOSITE COPPER NANOPARTICLES
Document Type and Number:
WIPO Patent Application WO/2024/024432
Kind Code:
A1
Abstract:
One purpose of the present invention is to provide composite copper nanoparticles that have a high dispersibility with respect to an organic solvent and with which it is possible to form a smooth electroconductive film. Provided are composite copper nanoparticles in which the surface of copper nanoparticles is modified with a silane coupling agent, the copper nanoparticles having, on at least a part of the surface thereof, a coating containing copper oxide. The mass concentration of carbon due to the silane coupling agent in the composite copper nanoparticles is 0.1-1.2 mass% relative to the total mass of the composite copper nanoparticles, or the number of surface groups derived from the silane coupling agent on the surface of the composite copper nanoparticles is 1.0-13.0 inclusive per 1 nm2 of the surface area of the composite copper nanoparticles.
Inventors:
YAMAWAKI NAOYA (JP)
TAKADA KATSUNORI (JP)
IGARASHI HIROSHI (JP)
TAKADA KATSUNORI (JP)
IGARASHI HIROSHI (JP)
Application Number:
PCT/JP2023/024954
Publication Date:
February 01, 2024
Filing Date:
July 05, 2023
Export Citation:
Assignee:
TAIYO NIPPON SANSO CORP (JP)
International Classes:
B22F1/00; B22F1/052; B22F1/102; C09C3/06; C09C3/08
Foreign References:
| JP2017165796A | 2017-09-21 | |||
| JP7121173B1 | 2022-08-17 |
Attorney, Agent or Firm:
SHIGA INTERNATIONAL PATENT OFFICE (JP)
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