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Patent Searching and Data


Title:
COMPOSITE FILM, LID, AND CONTENT-FILLED, LID-EQUIPPED CONTAINER
Document Type and Number:
WIPO Patent Application WO/2022/239700
Kind Code:
A1
Abstract:
The present invention forms a laminate having a specific layer configuration which uses specific materials from a composite film for forming a resealable package by heat-sealing, and as a result, makes it easy to break the inner edge even when opening in a low-temperature environment and minimizes residue of a film comprising an adhesive layer and a heat-sealing layer on the resealing part.

Inventors:
ONO SHIORI (JP)
YOSHIMURA SEIGO (JP)
TANIKAWA RYOJI (JP)
Application Number:
PCT/JP2022/019531
Publication Date:
November 17, 2022
Filing Date:
May 02, 2022
Export Citation:
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Assignee:
KYODO PRINTING CO LTD (JP)
International Classes:
B32B25/08; B32B27/00; B65D77/20
Foreign References:
JP2014065296A2014-04-17
JP2021507828A2021-02-25
JP2002301786A2002-10-15
JPH1044295A1998-02-17
JP2009270110A2009-11-19
JP2022033714A2022-03-02
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
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