SOLDER PARTICLE CLASSIFYING METHOD, SOLDER PARTICLE, SOLDER PARTICLE CLASSIFYING SYSTEM, ADHESIVE COMPOSITION, AND ADHESIVE FILM

WIPO Patent Application WO/2022/239701

A1

This solder particle classifying method includes: a first step of forming an electric field between a first electrode 2 and a second electrode 3 which are included in an electrostatic attraction device, the first electrode 2 comprising a disposition part that has electrical conductivity or electrostatic diffusivity, the second electrode 3 comprising an insulating attraction part 4 that faces the disposition part and that is provided with a plurality of openings 10 opened to the disposition part side, whereby solder particles P disposed in the disposition part are electrostatically attracted to the attraction part 4; a second step of removing solder particles P2 attracted to a portion excluding the openings 10 of the attraction part 4; and a third step of collecting, from the attraction part 4 having been through the second step, solder particles P1 accommodated in the openings. The average particle size of the solder particles P is 10 μm or more.

SUGIMOTO TOSHIYUKI (JP)
YAMAZAKI SHOHEI (JP)
IZAWA HIROYUKI (JP)

PCT/JP2022/019535

November 17, 2022

May 02, 2022

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SHOWA DENKO MATERIALS CO LTD (JP)
SUGIMOTO TOSHIYUKI (JP)

B03C7/02; B07B13/04

WO2020004510A1	2020-01-02
WO2021095726A1	2021-05-20

JPH11152598A	1999-06-08
JP2021057293A	2021-04-08
JP2021028895A	2021-02-25
JP2019202239A	2019-11-28
JP2004113929A	2004-04-15
JP2004025128A	2004-01-29
JP2003272790A	2003-09-26

HASEGAWA Yoshiki et al. (JP)

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