Title:
COMPOSITE FILM
Document Type and Number:
WIPO Patent Application WO/2023/204144
Kind Code:
A1
Abstract:
Provided is a composite film that has a low electrical connection resistance. A composite film (1) comprises a copper foil (10) and a conductive layer (20) which is composed of a conductive tackiness agent containing a conductive filler or a conductive adhesive agent containing a conductive filler, and which is stacked on at least one (10a) of two surfaces of the copper foil (10). The conductive filler has a number-average particle diameter of 0.12 μm to 7 μm inclusive. Of the two surfaces of the copper foil (10), the surface (10a) on which the conductive layer (20) is stacked has an expanded area ratio Sdr of 0.01% to 40% inclusive, a skewness Ssk of -1.0 to 1.0 inclusive, and a contact resistance of 2 mΩ to 30 mΩ inclusive.
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Inventors:
SHINOZAKI JUN (JP)
SANO JUNRO (JP)
NAKATSUGAWA TATSUYA (JP)
KATAHIRA SHUSUKE (JP)
SANO JUNRO (JP)
NAKATSUGAWA TATSUYA (JP)
KATAHIRA SHUSUKE (JP)
Application Number:
PCT/JP2023/015078
Publication Date:
October 26, 2023
Filing Date:
April 13, 2023
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
H05K9/00; B32B7/06; B32B15/08; B32B15/20; B32B27/00; B32B27/20; H05K3/28
Domestic Patent References:
| WO2018110579A1 | 2018-06-21 | |||
| WO2018207786A1 | 2018-11-15 | |||
| WO2013108599A1 | 2013-07-25 | |||
| WO2014132951A1 | 2014-09-04 |
Foreign References:
| JP2022021641A | 2022-02-03 |
Attorney, Agent or Firm:
TANAKA Hidetetsu et al. (JP)
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