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Title:
COMPOSITE MATERIAL, ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/135140
Kind Code:
A1
Abstract:
A composite material which is composed of: a base resin; a heat dissipation filler which is mixed into the base resin; hollow particles which are mixed into the base resin; hollow particles which are mixed into the base resin; and air bubbles which are formed in the base resin.

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Inventors:
SUGIYAMA TAIKI (JP)
ISHIDA YUICHI (JP)
Application Number:
PCT/JP2017/042775
Publication Date:
July 26, 2018
Filing Date:
November 29, 2017
Export Citation:
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Assignee:
SONY CORP (JP)
International Classes:
C08J9/32; C08J9/14; C08J9/30; C08K7/22; H01L23/36; H01L23/373; H05K7/20
Domestic Patent References:
WO2016013078A12016-01-28
Foreign References:
JP2012102263A2012-05-31
JP2013095761A2013-05-20
JP2002128931A2002-05-09
JP2011088974A2011-05-06
JP2016098301A2016-05-30
JP2013153361A2013-08-08
JP2005017917A2005-01-20
JP2008287992A2008-11-27
JP2013231166A2013-11-14
Attorney, Agent or Firm:
SUGIURA, Masatomo et al. (JP)
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