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Patent Searching and Data


Title:
COMPOSITE MATERIAL, HEAT SPREADER AND SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2022/172855
Kind Code:
A1
Abstract:
This composite material is in the form of a plate which has a first surface and a second surface that is on the reverse side of the first surface. This composite material comprises a plurality of first layers and at least one second layer. The first layers and the second layer are alternately stacked upon each other in the thickness direction of the composite material so that the first layers are positioned in the first surface and the second surface. The first layers contain copper. The second layer is a layer of a molybdenum powder compact that is impregnated with copper. As determined by X-ray diffraction analysis of an arbitrary cross-section of the second layer, the cross-section being parallel to the interface between a first layer and the second layer, the value obtained by dividing the X-ray diffraction intensity corresponding to the (211) plane of molybdenum by the X-ray diffraction intensity corresponding to the (200) plane of molybdenum is 2 or more.

Inventors:
MAEDA TORU (JP)
MIYANAGA MIKI (JP)
ITO MASAYUKI (JP)
YAMAGATA SHIN-ICHI (JP)
Application Number:
PCT/JP2022/004283
Publication Date:
August 18, 2022
Filing Date:
February 03, 2022
Export Citation:
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Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
ALMT CORP (JP)
International Classes:
H01L23/12; H01L23/14; H01L23/36; H01L23/373; H05K7/20
Foreign References:
JP2001358266A2001-12-26
JP2019096654A2019-06-20
JP2020150244A2020-09-17
JP2002121639A2002-04-26
JPH11307701A1999-11-05
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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