COMPOSITE-MATERIAL MOLDING APPARATUS AND COMPOSITE-MATERIAL MOLDING METHOD

WIPO Patent Application WO/2020/261354

A1

Provided is a composite-material molding apparatus 100 equipped with a mandrel (10) for holding the inner circumferential surface (Li) of a laminate (L) extending along an axis (X), a holder (20) for holding the outer circumferential surface (Lo) of the laminate (L) that includes a resin material, a motor for generating a driving force to rotate the mandrel (10) around the axis (X), and a heater (40) for heating the laminate (L) held by the holder (20) and mandrel (10), in which the holder (20) holds the outer circumferential surface (Lo) of the laminate (L) at a predetermined position in the radial direction (Rd), and the mandrel (10) generates a biasing force toward the outer circumferential side of the radial direction (Rd) in response to being rotated around the axis (X) by the driving force generated by the motor and has a pressurizing mechanism (11) that pressurizes the laminate (L) by the biasing force.

WO/2023/174893	MOLD ASSEMBLY FOR MANUFACTURING A COMPOSITE PART AND RELATED METHODS
WO/2020/213698	METAL/FIBER-REINFORCED RESIN COMPOSITE
WO/2002/081210	METHOD OF MANUFACTURING A HOLLOW SECTION, GRID STIFFENED PANEL

KANI YUKI (JP)
TANAKA YUYA (JP)
MASUKO TETSUYUKI (JP)
OZAKI RYOTA (JP)

PCT/JP2019/025037

December 30, 2020

June 25, 2019

Click for automatic bibliography generation  

MITSUBISHI HEAVY IND LTD (JP)

B29C70/34; B29C70/44

WO2008093757A1

2008-08-07

US2999780A	1961-09-12
JP2016221965A	2016-12-28
JPS5391978A	1978-08-12
US20180036959A1	2018-02-08
JP2015203046A	2015-11-16
US20120111486A1	2012-05-10
JPH07125092A	1995-05-16

FUJITA, Takaharu (JP)

View/Download PDF      PDF Help

Previous Patent: APPARATUS FOR DRIVING SWITCHING DEVICE

Next Patent: SEMICONDUCTOR FILM