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Title:
COMPOSITE MATERIAL MOLDING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/158416
Kind Code:
A1
Abstract:
Provided is a composite material molding method such that the occurrence of temperature unevenness in a composite material being heated is reduced. The composite material molding method is a method for molding a composite material 10 having reinforcement fibers 12, said method comprising an identical potential material connection step and a magnetic field application step. The identical potential material connection step is a step for connecting, in the composite material 10 prior to the reaction, the end portions of the reinforcement fibers 12 with an identical potential material 16 to form a conductive loop containing the reinforcement fibers 12. The magnetic field application step is a step for applying a magnetic field 42 in a direction intersecting with the plane wherein the conductive loop has been formed.

Inventors:
TAKAYANAGI TOSHIYUKI (JP)
ISHIKAWA NAOMOTO (JP)
NISHIMURA WATARU (JP)
KAMIHARA NOBUYUKI (JP)
KAMO SOTA (JP)
TAKAGI KIYOKA (JP)
ISHIDA TAKASHI (JP)
DENGO TOMOHARU (JP)
MURAOKA MIKIO (JP)
YOSHIDA YUKIHIRO (JP)
Application Number:
PCT/JP2020/001292
Publication Date:
August 06, 2020
Filing Date:
January 16, 2020
Export Citation:
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Assignee:
MITSUBISHI HEAVY IND LTD (JP)
UNIV AKITA (JP)
International Classes:
B29C70/20; B29C70/40
Domestic Patent References:
WO2017183467A12017-10-26
Foreign References:
JP2016221930A2016-12-28
JP2016508085A2016-03-17
JP2014116293A2014-06-26
Other References:
See also references of EP 3885111A4
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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