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Title:
COMPOSITE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2021/201064
Kind Code:
A1
Abstract:
A composite material 1 according to the present invention comprises a solid portion 10 comprising inorganic particles 20 and a resin 30. The solid portion 10 has a porous structure formed inside which has a plurality of voids 40 therein. The composite material 1 has a thermal conductivity of 0.5 W/(m·K) or higher and a spring constant of 100-70,000 N/m. The thermal conductivity is a value determined in accordance with American Society for Testing Materials (ASTM) D5470-01 using one specimen by the symmetrical configuration method.

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Inventors:
OTSUKA TETSUYA (JP)
MIMURA TAKANOBU (JP)
KATO TOMOYA (JP)
Application Number:
PCT/JP2021/013739
Publication Date:
October 07, 2021
Filing Date:
March 30, 2021
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
International Classes:
C08J9/26; C08J9/16; C08J9/224; C08K3/00; C08L101/00; C09K5/14
Domestic Patent References:
WO2019131622A12019-07-04
Foreign References:
JP2018109101A2018-07-12
JP2019131760A2019-08-08
JP2019127535A2019-08-01
JP2018512493A2018-05-17
JP2015105282A2015-06-08
JP2016071108A2016-05-09
JP2007320988A2007-12-13
JP2018109101A2018-07-12
JP2009191171A2009-08-27
Other References:
See also references of EP 4130122A4
Attorney, Agent or Firm:
KAMADA Koichi et al. (JP)
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