Title:
COMPOSITE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2021/201065
Kind Code:
A1
Abstract:
A composite material 1 pertaining to the present invention comprises a solid part 10 including inorganic particles 20 and a resin 30. Inside the solid part 10, a porous structure including a plurality of voids 40 is formed. The composite material 1 satisfies (i) and/or (ii). (i) P2 is 500 or greater. (ii) The thermal conductivity of the composite material 1 is 0.5 W/(m∙K) or greater, the thickness of the composite material 1 is 0.5-2.5 mm, the average diameter of the voids 40 is 40-1500 µm, and P3 is 70-90%. P2 = Thermal conductivity [W/(m∙K)] of composite material 1 × P3 × 100/content (vol%) of inorganic particles 20. P3[%] = (F0 – F1) × 100/F0.
Inventors:
OTSUKA TETSUYA (JP)
MIMURA TAKANOBU (JP)
KATO TOMOYA (JP)
MIMURA TAKANOBU (JP)
KATO TOMOYA (JP)
Application Number:
PCT/JP2021/013740
Publication Date:
October 07, 2021
Filing Date:
March 30, 2021
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C08J9/26; C08J5/18; C08K3/00; C08L101/00
Foreign References:
| JP2003060134A | 2003-02-28 | |||
| JP2011176024A | 2011-09-08 | |||
| JP2010144152A | 2010-07-01 | |||
| JP2013136658A | 2013-07-11 | |||
| JP2018109101A | 2018-07-12 | |||
| JP2009191171A | 2009-08-27 |
Other References:
See also references of EP 4130119A4
Attorney, Agent or Firm:
KAMADA Koichi et al. (JP)
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