Title:
COMPOSITE MODULE
Document Type and Number:
WIPO Patent Application WO/2013/179875
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a composite module, which is capable of reducing floating capacitance generated in a wiring electrode, and adjusting impedance of the wiring electrode, while preventing leak signals from the outside from interfering with the wiring electrode formed inside of the wiring substrate.
A composite module (1) is provided with: an external ground electrode (5) formed on one main surface of a wiring board (2), a wiring electrode (6) formed inside of the wiring board (2); and a first ground electrode (7) formed between the wiring electrode (6) and the external ground electrode (5). In the first ground electrode (7), a cutout (10) is formed at least in a portion of a region that overlaps, in a planar view, the wiring electrode (6) and the external ground electrode (5), and the wiring electrode (6) is disposed to overlap, in a planar view, the first ground electrode (7) and/or the external ground electrode (5), thereby making it possible to reduce floating capacitance generated in the wiring electrode (6) and to adjust impedance of the wiring electrode (6), while preventing the leak signals from the outside from interfering with the wiring electrode (6).
Inventors:
KITAJIMA HIROMICHI (JP)
Application Number:
PCT/JP2013/063247
Publication Date:
December 05, 2013
Filing Date:
May 13, 2013
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H04B1/40; H01L23/12
Foreign References:
| JP2007287916A | 2007-11-01 | |||
| JP2002290058A | 2002-10-04 | |||
| JP2009246317A | 2009-10-22 | |||
| JP2006278780A | 2006-10-12 |
Attorney, Agent or Firm:
YANASE, Yuji et al. (JP)
Yuji Yanase (JP)
Yuji Yanase (JP)
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