Title:
COMPOSITE SUBSTRATE AND ELECTRICAL DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/172653
Kind Code:
A1
Abstract:
The purpose of the present invention is to compactly interconnect at least three substrates with flat cables. A composite substrate according to the present invention includes: a first substrate including a first connector and a second connector in which the width directions thereof are parallel to a first direction; a second substrate including a third connector and a fourth connector in which the width directions thereof are parallel to the first direction; a third substrate including a fifth connector and a sixth connector in which the width directions thereof are parallel to the first direction; a first flat cable connecting the first connector and the third connector; a second flat cable connecting the second connector and the fifth connector; and a third flat cable connecting the fourth connector and the sixth connector.
Inventors:
HORII YUJI (JP)
Application Number:
PCT/JP2022/000310
Publication Date:
August 18, 2022
Filing Date:
January 07, 2022
Export Citation:
Assignee:
NEC PLATFORMS LTD (JP)
International Classes:
H05K7/14
Foreign References:
| JPS4631363B1 | 1971-09-11 | |||
| JPS60118813U | 1985-08-10 | |||
| JPS522252U | 1977-01-08 | |||
| US4700274A | 1987-10-13 |
Attorney, Agent or Firm:
KITAJIMA Hiroshi et al. (JP)
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