Title:
COMPOSITE SUBSTRATE, PIEZOELECTRIC DEVICE AND METHOD OF MANUFACTURING COMPOSITE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2014/010696
Kind Code:
A1
Abstract:
A composite substrate (10) comprises: a piezoelectric substrate (12) and a support layer (14) connected with the piezoelectric substrate (12), made of material with no crystal anisotropy in the bonding plane, and whose thickness is less than that of the piezoelectric substrate (12). Also, the piezoelectric substrate (12) and the support layer (14) are bonded by means of an adhesive layer (16). The overall thickness of the composite substrate (10) is no more than 180 µm. The base thickness ratio Tr = t2/(t1 + t2) is at least 0.1 but no more than 0.4, where the thickness of the piezoelectric substrate (12) is t1 and the thickness of the support layer (14) is t2. The thickness t1 is no more than 100 µm. The thickness t2 is no more than 50 µm. The support layer (14) is formed by for example glass such as boron silicate glass or quartz glass, Si, SiO2, sapphire, ceramics, metal such as copper, or the like.
Inventors:
HORI YUJI (JP)
TAI TOMOYOSHI (JP)
HAMAJIMA AKIRA (JP)
NAKAHARA TOSHINAO (JP)
TAI TOMOYOSHI (JP)
HAMAJIMA AKIRA (JP)
NAKAHARA TOSHINAO (JP)
Application Number:
PCT/JP2013/069031
Publication Date:
January 16, 2014
Filing Date:
July 11, 2013
Export Citation:
Assignee:
NGK INSULATORS LTD (JP)
International Classes:
H03H9/145
Foreign References:
| JPH1155070A | 1999-02-26 | |||
| JP2004297693A | 2004-10-21 | |||
| JP2005094254A | 2005-04-07 |
Attorney, Agent or Firm:
ITEC INTERNATIONAL PATENT FIRM (JP)
Patent business corporation Itec international patent firm (JP)
Patent business corporation Itec international patent firm (JP)
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