Title:
COMPOSITE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2022/202146
Kind Code:
A1
Abstract:
One aspect of the present disclosure provides a composite substrate comprising a ceramic plate, a soldering material layer that contains silver and tin and is provided on the ceramic plate, and a metal substrate that contains a region formed by diffusion of the silver and tin and that is joined to the ceramic plate via the soldering material layer, wherein in a cross section that is orthogonal to the joint surface between the ceramic plate and the metal substrate, if the thickness of a silver dispersion region is denoted as X, the thickness of a tin dispersion region is denoted as Y, then the ratio of Y to X is 0.10 to 1.00.
Inventors:
AONO RYOTA (JP)
TAKEFUJI TAKAYUKI (JP)
USHIJIMA YUTAKA (JP)
TANAKA JUNICHI (JP)
TAKEFUJI TAKAYUKI (JP)
USHIJIMA YUTAKA (JP)
TANAKA JUNICHI (JP)
Application Number:
PCT/JP2022/008566
Publication Date:
September 29, 2022
Filing Date:
March 01, 2022
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
C04B37/02; H05K1/03; H05K3/38
Domestic Patent References:
| WO2022024990A1 | 2022-02-03 | |||
| WO2018180965A1 | 2018-10-04 |
Foreign References:
| JP2016169111A | 2016-09-23 | |||
| JP2003188310A | 2003-07-04 | |||
| JPH0524943A | 1993-02-02 | |||
| JPH11130555A | 1999-05-18 | |||
| JP2014118310A | 2014-06-30 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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