COMPOSITION FOR CURABLE RESINS, CURED PRODUCT OF SAID COMPOSITION, METHOD FOR PRODUCING SAID COMPOSITION, METHOD FOR PRODUCING SAID CURED PRODUCT, AND SEMICONDUCTOR DEVICE

WIPO Patent Application WO/2020/122045

A1

[Problem] To provide: a composition for curable resins, which is used for the purpose of obtaining a highly heat-resistant cured product, and which has excellent curability at low temperatures; a cured product of this composition for curable resins; a method for producing this composition for curable resins; and a method for producing this cured product. In addition, to provide a semiconductor device which uses this cured product as a sealing material. [Solution] A composition for curable resins according to the present invention contains (A) a benzoxazine compound having a structure represented by formula (1), (B) an epoxy compound and (C) a phenolic curing agent; the number of epoxy groups in the epoxy compound (B), the number of benzoxazine rings in the benzoxazine compound (A) and the number of hydroxyl groups in the phenolic curing agent (C) satisfy formula (2); and the ratio of the benzoxazine equivalent of the benzoxazine compound (A) to the hydroxyl equivalent of the phenolic curing agent (C) is from 1.1 to 8.0.

NISHITANI YOSHINORI (JP)
SATO TATSUKI (JP)
MINAMI MASAKI (JP)

PCT/JP2019/048200

June 18, 2020

December 10, 2019

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JXTG NIPPON OIL & ENERGY CORP (JP)

C08G14/073; C08G59/40; H01L23/29; H01L23/31

WO2018105743A1

2018-06-14

US20170327683A1	2017-11-16
JP2018188611A	2018-11-29
JP2017020011A	2017-01-26
JP2002053643A	2002-02-19

NAGAI Hiroshi et al. (JP)

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