Title:
COMPOSITION FOR FORMING LASER DIRECT STRUCTURING LAYER, KIT, AND METHOD FOR PRODUCING RESIN MOLDED ARTICLE WITH PLATING LAYER
Document Type and Number:
WIPO Patent Application WO/2016/002660
Kind Code:
A1
Abstract:
The present invention makes it possible to form a plating layer on the surface of a resin molded article obtained from a thermoplastic resin composition even without mixing a laser direct structuring additive into the thermoplastic resin composition. Provided is a composition for forming a laser direct structuring layer, said composition including an aqueous organic substance, water, and a laser direct structuring additive. Further provided are a kit that includes the composition for forming a laser direct structuring layer, and a method for producing a resin molded article with a plating layer.
More Like This:
Inventors:
SUGIYAMA MASAHIDE (JP)
YAMADA RYUSUKE (JP)
KIKUCHI TATSUYA (JP)
YAMANAKA YASUSHI (JP)
YAMADA RYUSUKE (JP)
KIKUCHI TATSUYA (JP)
YAMANAKA YASUSHI (JP)
Application Number:
PCT/JP2015/068536
Publication Date:
January 07, 2016
Filing Date:
June 26, 2015
Export Citation:
Assignee:
MITSUBISHI ENG PLASTICS CORP (JP)
International Classes:
C23C18/20; C08L101/12; C09D7/61; C09D7/65
Foreign References:
| JP2000154266A | 2000-06-06 | |||
| JP2011068995A | 2011-04-07 | |||
| JPH10183362A | 1998-07-14 | |||
| JP2003096221A | 2003-04-03 |
Other References:
See also references of EP 3162915A4
Attorney, Agent or Firm:
SIKs & Co. (JP)
Patent business corporation patent firm Sykes (JP)
Patent business corporation patent firm Sykes (JP)
Download PDF: