Title:
COMPOSITION FOR FORMING RELEASE LAYER
Document Type and Number:
WIPO Patent Application WO/2015/152121
Kind Code:
A1
Abstract:
The present invention provides a composition for forming a release layer that maintains adhesion to a glass substrate provided with the release layer and prevents release at the interface between the release layer and the glass substrate, while making it possible to easily release a layer or group of layers formed above the release layer from the release layer. The present invention provides a composition for forming a release layer that is provided directly above a glass substrate, said composition having (A) an aromatic polyimide and/or aromatic polyimide precursor, and (B) an amide solvent, wherein the aromatic polyimide of (A) satisfies the belowmentioned (1)-(4): (1) the temperature for a 1% weight reduction during weight change that occurs during heating is 500 °C or more; (2) the refractive index at a wavelength of 1000 nm is 1.7 or more; (3) the difference between the refractive index and birefringence at a wavelength of 1000 nm is 0.15 or more; and (4) the surface energy is 40 dyne/cm or more.
Inventors:
EBARA KAZUYA (JP)
SHINDO KAZUYA (JP)
SHINDO KAZUYA (JP)
Application Number:
PCT/JP2015/059850
Publication Date:
October 08, 2015
Filing Date:
March 30, 2015
Export Citation:
Assignee:
NISSAN CHEMICAL IND LTD (JP)
International Classes:
C08L79/08; B32B17/10; B32B27/34; C08G73/10; C08K5/16; H01L21/02; H01L27/12
Domestic Patent References:
| WO2011030716A1 | 2011-03-17 | |||
| WO2010071145A1 | 2010-06-24 |
Foreign References:
| JPH05315630A | 1993-11-26 | |||
| JP2009021322A | 2009-01-29 | |||
| JP2014022459A | 2014-02-03 | |||
| JP2012102155A | 2012-05-31 | |||
| JP2012035583A | 2012-02-23 | |||
| JP2015074783A | 2015-04-20 | |||
| JP2014218056A | 2014-11-20 |
Attorney, Agent or Firm:
YOSHIZAWA, Takao et al. (JP)
Takao Yoshizawa (JP)
Takao Yoshizawa (JP)
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