Title:
COMPOSITION FOR FORMING RESIST UNDERLAYER FILM, PATTERN FORMATION METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/106536
Kind Code:
A1
Abstract:
Disclosed are: a composition for forming a resist underlayer film, which comprises a resin having an aromatic ring and a compound represented by general formula (1), wherein the content of the compound represented by general formula (1) is 0.1 to 500 ppm by mass inclusive relative to the whole mass of the composition for forming a resist underlayer film; and a pattern formation method and an electronic device manufacturing method, each using the composition for forming a resist underlayer film. Accordingly, provided are; a composition for forming a resist underlayer film, which makes it possible to prevent the occurrence of coating defects after the elapse of a certain time period and can have excellent flatness after the elapse of a certain time period; and a pattern formation method and an electronic device manufacturing method, each using the composition for forming a resist underlayer film. In general formula (1), R1 to R3 independently represent an alkyl group having 1 to 5 carbon atoms.
Inventors:
YAMAMOTO KEI (JP)
KAMIMURA SOU (JP)
KAWABATA TAKESHI (JP)
KAMIMURA SOU (JP)
KAWABATA TAKESHI (JP)
Application Number:
PCT/JP2020/041715
Publication Date:
June 03, 2021
Filing Date:
November 09, 2020
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/11; G03F7/20
Foreign References:
| JP6574849B2 | 2019-09-11 | |||
| JP2016135756A | 2016-07-28 | |||
| JP2019020701A | 2019-02-07 | |||
| JP2003241385A | 2003-08-27 | |||
| JP2011022348A | 2011-02-03 |
Attorney, Agent or Firm:
KOH-EI PATENT FIRM, P.C. (JP)
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